耐高温聚酰亚胺胶粘剂的研究进展

材料工程, 2010, (z1): 352-355. doi: 10.3969/j.issn.1001-4381.2010.z1.076

耐高温聚酰亚胺胶粘剂的研究进展

霍海涛 ^1, , 孙宏杰 ^2, , 莫松 ^3, , 杨士勇 ^4, , 范琳 ^5,

1.中国科学院化学研究所高技术材料实验室,北京100190

2.中国科学院化学研究所高技术材料实验室,北京100190

3.中国科学院化学研究所高技术材料实验室,北京100190

4.中国科学院化学研究所高技术材料实验室,北京100190

5.中国科学院化学研究所高技术材料实验室,北京100190

关键词：聚酰亚胺 , 胶粘剂 , 耐高温 , 粘接性能

Development of High Temperature Resistant Polyimide Adhesives

综述了近年来国内外耐高温聚酰亚胺胶粘剂的研究发展状况,对热塑性和热固性聚酰亚胺胶粘剂的化学结构与性能特点进行了分析和总结,并对耐高温聚酰亚胺胶粘剂的未来发展趋势进行了展望.

参考文献

[1]	STUEBEN KC.Adhesive chemistry:developments and trends[M].New York:Plenum Press,1984:445.
[2]	Paul M. Hergenrother .The Use, Design, Synthesis, and Properties of High Performance/High Temperature Polymers: an Overview[J].High performance polymers,2003(1):3-45.
[3]	丁孟贤.聚酰亚胺-化学、结构与性能的关系及材料[M].北京:科学出版社,2006:647-670.
[4]	STCLAIR AK;STCIAIR TL .A multipurpose thermoplastic polyimide[J].SAMPE QUARTERLY-SOCIETY FOR THE ADVANCEMENT OF MATERIAL AND PROCESS ENGINEERING,1981,13(01):20-25.
[5]	STCLAIR TL;YAMAKI DA .A thermoplastic polyimidesulfone[Report TM-1982-84574][R].NASA,1982.
[6]	PROGAR DJ .Processing study of a high temperature adhesive[J].International Journal of Adhesion and Adhesives,1984,4(02):79-86.
[7]	ST.CLAIR TL;PROGAR DJ .A novel addition polyimide adhesive[Report TM-1981-81976][R].NASA,1981.
[8]	OGLIARUSO MA;ROMANELLI MG;BECKER EI .Chemistry of cyclopentadienones[J].Chemical Reviews,1965,65(03):261-367.
[9]	BILOW N;LANDIS A L;BOSCHAN R H;FASOLD J G .Acetylene-substituted polyimide adhesives[J].Sampe Journal,1982,18(01):8-15.
[10]	KUHBANDER RJ;APONYI TJ.Thermid 600 adhesive formulation studies[A].,1979:295-308.
[11]	CONNELL JW;SMITH JG;HERGENROTHER PM .Imide oligomers containing pendent and terminal phenylethynyl groupsⅡ[J].High Performance Polymers,1998,10(03):273-283.
[12]	Hergenrother PM.;Smith JG.;Connell JW. .Phenylethynyl containing imide oligomers[J].Polymer: The International Journal for the Science and Technology of Polymers,2000(13):5073-5081.
[13]	J. G. Smith Jr.;J. W. Connell;P. M. Hergenrother .The effect of phenylethynyl terminated imide oligomer molecular weight on the properties of composites[J].Journal of Composite Materials,2000(7):614-628.
[14]	ROBERTO J.CANO;JENSEN BJ .Effect of molecular weight on adhesive properties of the phenylethynyl-terminated polyimide LARCTM-PETI-5[Report TM-1994-111558][R].NASA,1994.
[15]	JENSEN BJ;CHANG AC .Synthesis and characterization of modified phenylethynyl imides[J].High Performance Polymers,1998,10(02):175-180.
[16]	Connell John W;Smith Jr Joseph G;Hergenrother Paul M;Rommel Monica L .Neat resin, adhesive and composite properties of reactive additive/PETI-5 blends[J].High performance polymers,2000(2):323-333.

上一张下一张

上一张下一张

计量

下载量()
访问量()

作者相关

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%