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以Si粉为烧结助剂,采用真空热压烧结工艺制备B4C-SiCw陶瓷复合材料.将不同含量的SiCw与B4C和Si混合,制得的复合粉体在1850℃、60MPa下真空热压烧结,研究了SiCw含量对复合材料力学性能的影响,并借助X射线衍射、扫描电镜分析了复合材料的物相组成和微观结构.研究结果表明:分散处理后的SiCw可以有效地提高复合材料的力学性能,当晶须含量为10%(质量分数)时,弯曲强度和断裂韧性达到最大值,分别为468 MPa和5.70 MPa·m1/2.复合材料中SiCw的拔出使复合材料的弯曲强度及断裂韧性得以提高.

参考文献

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