研究了冷挤压和回火工艺对低陶瓷比例的Ti3AlC2/Cu复合材料密度、硬度和内部缺陷的改善作用.不同比例的Ti3AlC2和铜粉混合后,在200MPa下冷等静压成块体,然后在1150℃下无压烧结.烧结后的块体在室温下挤压,然后在950℃下回火30min,重复上述挤压和回火过程.显微照片显示Ti3AlC2颗粒分布更加均匀,并且长度从烧结后的约20μm破裂为二次回火后的约10μm,块体密度提升5.08％,硬度提升19.83％.所以冷挤压和回火工艺可以有效改善Ti3AlC2/Cu复合材料的性能.
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