基于B2O3-CaO-BaO-Al2O3-SiO2-La2O3体系制备了BCAS微晶玻璃封接材料,利用X射线衍射定性分析、差热分析、热膨胀仪分析等手段对其进行了表征.热膨胀系数(TEC)为10.41×10-6K-1,与电解质YSZ的热膨胀系数(10.2～10.8)×10-6K-1相接近.玻璃转变温度T8值为638℃,在768～852℃之间有一个强的放热峰.700℃时其主晶相为BaAl2 Si2 O8,800℃时以钡长石为析出的主晶相,900℃时析出单一的BaAl2Si2O8相及少量的BaSiO3相.封接材料的电阻随温度升高而减小,在650～800℃之间,阻抗值均在104～105Ω·cm2范围内,离子跃迁活化能为101.38 kJ/mol.其高温浸润性研究表明BCAS1微品玻璃封接材料可用于IT-SOFC对电解质YSZ的封接.
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