利用非平衡磁控溅射技术在钢基体上制备以W为中间层的C/W多层膜,使用扫描电子显微镜(SEM)、X射线衍射仪(XRD)和透射电子显微镜(TEM)对镀层的表面形貌,相组成及截面微观结构进行分析;测试镀层的膜基结合强度和摩擦性能.结果表明:C/W多层膜是由非晶碳和WC纳米晶组成的复合镀层,具有明显的层状结构,周期厚度为6.5nm;镀层具有良好的减摩性能,摩擦因数随偏压的增大而降低,-90V偏压条件下沉积的镀层具有最低的摩擦因数(0.14);镀层的膜基结合强度较差,W中间层的厚度为500nm,W中间层中存在较高的压应力,没有起到强化膜基结合强度的作用.
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