金属Cu中孪晶的作用已受到广泛关注.介绍了孪晶的分类及晶体学结构,综述了孪晶对Cu强度、塑性、加工硬化、应变速率敏感性、变形机制和电阻率(或电导率)等方面的影响规律及内在机理,讨论了孪晶Cu研究的不足之处及需要加强的方面,并指出通过适当的工艺技术,在晶粒中引入高密度的孪晶同时获得高强度、高塑性和良好电导性能,将是未来发展高性能工程用Cu及其合会的重要方向.
参考文献
[1] | CALLISTER D W.Materials Science and Engineering[M].New York:Wiley,2000:129-138. |
[2] | 申勇峰,卢磊,陈先华,钱立华,卢柯.纳米孪晶纯铜的强度和导电性[J].物理,2005(05):344-347. |
[3] | GLEITER H .Nanocrystalline materials[J].Progress in Materials Science,1989,33(04):223-315. |
[4] | Lim JW;Isshiki M .Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect[J].Journal of Applied Physics,2006(9):94909-1-94909-7-0. |
[5] | CHRISTIAN J W;MAHAJAN S .Deformation twinning[J].Progress in Materials Science,1995,39(1-2):1-157. |
[6] | SUTTON A P;BALLUFFI R W.Interfaces in Crystalline Materials[M].Clarendon:Oxford,1995 |
[7] | MURR L E;HECKER S S .Quantitative evidence for dislocation emission from grain boundaries[J].Scripta Metallurgica,1979,13(03):167-171. |
[8] | DAHLGREN S D;NICHOLSON W L;MERZ M D et al.Microstructural analysis and tensile properties of thick copper and nickel sputter deposits[J].THIN SOLID FILMS,1977,40(01):345-348. |
[9] | LU L;SHEN Y F;CHEN X H et al.Ultrahigh strength and high electrical conductivity in copper[J].Science,2004,304(5669):422-426. |
[10] | Y.F. SHEN;L. LU;Q.H. LU .Tensile properties of copper with nano-scale twins[J].Scripta materialia,2005(10):989-994. |
[11] | Ji Luo;Zhi Mei;Wenhuai Tian;Zhirui Wang .Diminishing of work hardening in electroformed polycrystalline copper with nano-sized and uf-sized twins[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1/2):282-290. |
[12] | XU L;DIXIT P;MIAO J et al.Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins[J].Applied Physics Letters,2006,90(03):0331111-0331113. |
[13] | L. Lu;R. Schwaiger;Z.W. Shan .Nano-sized twins induce high rate sensitivity of flow stress in pure copper[J].Acta materialia,2005(7):2169-2179. |
[14] | X. Zhang;A. Misra;H. Wang .Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning[J].Acta materialia,2004(4):995-1002. |
[15] | ZHANG X;WANG H;CHEN X H et al.High-strength sputter-deposited Cu foils with preferred orientation of nanosclale growth twins[J].Applied Physics Letters,2006,88:1731161-1731163. |
[16] | Hodge AM;Wang YM;Barbee TW .Large-scale production of nano-twinned, ultrafine-grained copper[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1-2):272-276. |
[17] | B.Z. Cui;K. Han;Y. Xin .Highly textured and twinned Cu films fabricated by pulsed electrodeposition[J].Acta materialia,2007(13):4429-4438. |
[18] | L. Lu;X. Chen;X. Huang;K. Lu .Revealing The Maximum Strength In Nanotwinned Copper[J].Science,2009(5914):607-610. |
[19] | Y.-H. Zhao;J. F. Bingert;X.-Z. Liao;B.-Z. Cui;K. Han;A. V. Sergueeva;A. K. Mukherjee;R. Z. Valiev;T. G. Langdon;Y. T. Zhu .Simultaneously Increasing the Ductility and Strength of Ultra-Fine-Grained Pure Copper[J].Advanced Materials,2006(22):2949-2953. |
[20] | Y. Zhang;N.R. Tao;K. Lu .Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles[J].Acta materialia,2008(11):2429-2440. |
[21] | M. Dao;L. Lu;Y.F. Shen .Strength, strain-rate sensitivity and ductility of copper with nanoscale twins[J].Acta materialia,2006(20):5421-5432. |
[22] | C.J. Youngdahl;J.R. Weertman;R.C. Hugo .DEFORMATION BEHAVIOR IN NANOCRYSTALLINE COPPER[J].Scripta materialia,2001(8-9):1475-1478. |
[23] | Z.-H. Jin;P. Gumbsch;E. Ma .The Interaction Mechanism of Screw Dislocations with Coherent Twin Boundaries in Different Face-Centred Cubic Metals[J].Scripta materialia,2006(6):1163-1168. |
[24] | REMY L .The interaction between slip and twinning systems and the influence of twinning on the mechanical behavior of fcc metals and alloys[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1981,12(03):387-392. |
[25] | SI.Asgari;E.El-Danaf .Strain Hardening Regimes and Microstructural Evolution during Large Strain Compression of Low Stacking Fault Energy Fcc Alloys That Form Deformation Twins[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,1997(9):1781-1795. |
[26] | F. Ebrahimi;Q. Zhai;D. Kong .Deformation and Fracture of electrodeposited copper[J].Scripta materialia,1998(3):315-321. |
[27] | MERZ M D;DAHLGREN S D .Tensile strength and work hardening of ultrafine-grained high-purity copper[J].Journal of Applied Physics,1976,46(08):3235-3237. |
[28] | X.H. Chen;L. Lu .Work hardening of ultrafine-grained copper with nanoscale twins[J].Scripta materialia,2007(2):133-136. |
[29] | Lei Lu;Ming Dao;Ting Zhu .Size dependence of rate-controlling deformation mechanisms in nanotwinned copper[J].Scripta materialia,2009(12):1062-1066. |
[30] | SHEN Y F;LU L;DAO M et al.Strain rate sensitivity of Cu with nanoscale twins[J].Scripta Materialia,2006,55(04):319-322. |
[31] | ANDREWS P V;WEST M B;ROBESON C R .The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminium[J].Philosophical Magazine,1969,19(161):887-896. |
[32] | NAKAMICHI I .Electrical resistivity and grain boundaries in metals[J].Materials Science Forum,1996,207-209(01):47-52. |
[33] | GANGULEE A .The structure of electroplated and vapor-deposited copper films[J].Journal of Applied Physics,1972,43(03):867-873. |
[34] | Chen XH;Lu L;Lu K .Electrical resistivity of ultrafine-grained copper with nanoscale growth twins[J].Journal of Applied Physics,2007(8):083708-1-083708-8-0. |
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