利用光学显微镜(OM)、扫描电子显微镜(SEM)、X射线衍射(XRD)分析了Cu元素对Mg-Zn-xCu-Ce合金铸态组织的影响,并用显微硬度仪测试合金的显微硬度.结果表明:Cu含量的增加可以显著细化晶粒.当Zn,Cu质量比小于1时,合金枝晶间共晶组织由薄层状α-Mg+CuMgZn组成；当Zn,Cu质量比等于1时,合金中出现Mg2Cu相,同时共晶组织开始粗化；随着Cu含量的升高(Cu质量分数大于Zn),合金枝晶间共晶组织由α-Mg+CuMgZn+Mg2Cu组成,在形态上由薄层状转变为蜂窝状.合金的显微硬度随着Cu含量升高而增加.
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