研究了纳米0.1％(质量分数)Al颗粒对SnAgCu无铅钎料与铜基板之间界面反应的影响,研究两种无铅钎料界面在-55～125℃热循环过程中的生长行为及其焊点力学性能变化.结果表明:随着热循环次数的增加,界面层金属间化合物的厚度明显增加,焊后界面层金属间化合物为Cu6 Sns相,在热循环过程中在Cu6Sn5和Cu基板之间出现Cu3Sn 相.发现纳米Al颗粒的添加,界面层金属间化合物的厚度明显减少,纳米颗粒对界面层的生长具有明显的抑制作用.同时对焊点在热循环过程中的可靠性进行分析,发现焊点的拉伸力随着循环次数的增加逐渐降低,含纳米Al颗粒的焊点具有明显的优越性,在焊点服役期间,焊点失效路径为Cu6Sn5/Cu3Sn的界面处.
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