研究固溶温度对Fe-Mn-Si-Cr-Ni-Mo合金形状记忆效应的影响,并从合金显微组织结构、层错能和热诱发ε马氏体等几个方面进行了讨论.结果表明,固溶温度大于1173K时,随着温度的升高,奥氏体晶粒度增大,并且应变回复率也降低;固溶温度1173K时,晶粒尺寸最小达45μm,组织中预存的热诱发ε马氏体最少,应变回复率也相对最大.说明热诱发ε马氏体对形状记忆效应不利;合金的层错几率和应变回复率的变化有着一样的趋势,层错几率越大,则合金的回复率也越高.
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