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  4. 电子微连接高温无铅钎料的研究进展

功能材料, 2013, 44(z1): 28-40. doi: 10.3969/j.issn.1001-9731.2013.增刊(Ⅰ).006

电子微连接高温无铅钎料的研究进展

甘贵生 1, , 杜长华 2, , 甘树德 3,

1.重庆理工大学材料科学与工程学院,重庆400054

2.重庆理工大学材料科学与工程学院,重庆400054

3.重庆理工大学材料科学与工程学院,重庆400054

基金项目:   重庆理工大学科研启动基金资助项目(2012ZD12)   重庆高校优秀成果转化重大资助项目(KJZH11215)  

关键词： 高温钎料 , 评述 , 电子微连接 , 合金化

Development of high-temperature lead-free solder in electronic micro-connection

GAN Gui-sheng 1, , DU Chang-hua 2, , GAN Shu-de 3,

1.重庆理工大学材料科学与工程学院,重庆400054

2.重庆理工大学材料科学与工程学院,重庆400054

3.重庆理工大学材料科学与工程学院,重庆400054

Keywords： high-temperature solder , review , electronic micro-connection , alloying

基于环保的压力和人类健康的需求,电子产品微连接材料采用无铅钎料代替传统含铅钎料已是必然趋势.总结了新型无铅高温钎料的基本要求,重点评述了Bi基合金、Au基合金、Zn基合金和Sn-Sb基合金等几类钎料国内外研究现状,指出通过多元合金相图计算、合金化、材料复合化的方式开发成本、工艺性能均能与含铅钎料相媲美的无铅高温钎料.

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