采用包覆工艺制备了 AgSnO2电接触材料，通过分散剂种类、球磨时间、活化剂种类等工艺参数的优化，制备了性能合格的AgSnO2电接触材料。实验结果表明，聚乙二醇对 SnO2颗粒具有较好的分散作用，但不能完全消除SnO2颗粒团聚；液态球磨能获得组织均匀的AgSnO2材料，但材料的电阻率过高；活化剂Bi2 O3和 CuO的加入能有效地提高材料的致密度和降低电阻率；在加入0．25％Bi2 O3＋0．25％CuO 并液态球磨4 h 后的试样致密度为98．2％，电阻率为2．25μΩ?cm。
Optimizing the parameters of type of dispersant,time of ball milling in liquid and type of activator, the AgSnO2 electrical contact materials with good performance were prepared by electroless plating.The results shows that polyethylene glycol had a good effect for dispersing SnO2 particles,but not completely eliminate the agglomeration of SnO2 particle;ball milling in liquid could make AgSnO2 had uniform organization,but had high electrical resistivity;activator of Bi2 O3 and CuO could effectively improve the density and reduce the elec-trical resistivity of materials;the relative density and electrical resistivity of AgSnO2 were 98.2% and 2.25μΩ?cm at ball milling in liquid of SnO2 particle with 0.25% Bi2 O3+0.25%CuO for 4 h,respectively.
参考文献
| [1] | 堵永国;张为军.常用触点材料的物理性能[J].电工材料,2002(1):35-39. |
| [2] | 陈敬超;孙加林;张昆华;杜焰;周晓龙;甘国友.银氧化镉材料的欧盟限制政策与其它银金属氧化物电接触材料的发展[J].电工材料,2002(4):41-44,49. |
| [3] | 许灿辉;易丹青;吴春萍;王斌;刘会群;卢小东.添加剂对Ag-ZnO电触头材料组织与性能的影响[J].功能材料,2008(8):1306-1309. |
| [4] | Jingchao Chen;Jing Feng;B.Xiao;K.H.Zhang;Y.P.Du;Z.J.Hong;R.Zhou.Interface Structure of Ag/SnO_2 Nanocomposite Fabricated by Reactive Synthesis[J].材料科学技术学报（英文版）,2010(1):49-55. |
| [5] | LU Jianguo;WANG Jingqin;ZHAO Jingying;WEN Ming;WANG Baozhu;WANG Xiaohong.A new contact material——Ag/SnO2-La2O3-Bi2O3[J].稀有金属(英文版),2002(04):289-293. |
| [6] | Gil Geun Lee;Toshiyuki Ohhira.Synthesis of SnO_2 Particle Dispersed Ag Alloy by Mechanical Alloying[J].粉体および粉末冶金,19966(6):795-800. |
| [7] | H.Zoz;H.Ren.Improved Ag-SnO_2 Electrical Contact Material Produced by Mechanical Alloying[J].Metall,19997-8(7-8):423-428. |
| [8] | 王家真;王亚平;杨志懋;王伟;丁秉钧.CuO添加剂对Ag/SnO2润湿性与界面特性的影响[J].稀有金属材料与工程,2005(3):405-408. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%