薄膜材料对微纳器件制造不可或缺,而其热导率直接限制微纳器件的散热性能,从而影响器件的可靠性.因此,研究薄膜热物理性质对于半导体器件的制造以及集成电路的设计极为重要.为此,对薄膜材料热导率测量方法进行了综述,并在分析薄膜微结构模型的基础上,对热导率测量方法进行了可行性分析,从而为薄膜材料热性能测量提供技术参考.
Thin film materials are indispensable for the fabrication of micro / nano devices, and their thermal conductivity directly limits the heat dissipation performance of micro / nano devices, which affects the performance and reliability of devices.Therefore, the thermo-physical properties of thin films is very important for the design and manufacture of semiconductor devices and integrated circuit design, Here, the thermal conductivity measurement method of thin film materials is reviewed.Based on the analysis of the microstructure model, the feasibility of the thermal conductivity measurement method is analyzed, which provides technical reference for thermal measurement of thin film materials.
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