测量了在FR4基板上用引线键合和顶充胶封装的湿度传感器在无防护、氮化硅薄膜防护、硅酮涂层防护、硅酮涂层加氮化硅薄膜防护四种情况下及在不同温湿度环境下的水汽扩散曲线.应用有限元分析和FICK扩散方程模拟了实验曲线,得到了水汽在各种防护条件下的扩散系数,进而计算出水汽扩散的激活能,定量比较了各种防护方法的效果.实验和模拟结果表明:硅酮加氮化硅薄膜的双层防护可以显著改善电子模块的防水性能.
参考文献
| [1] | Helge Kristiansen,Johan Liu,Overview of Conductive Adhesive Interconnection Technologies for LCD's[J],IEEE Transaction on Components,Packaging and Manufacture Technology-Part A,1995,21(2):208. |
| [2] | Anant G Sabnis.VLSI Reliability[M],San Diego,California:Academic Press Inc.,1990,24. |
| [3] | Debbie Hagen,Susan Downey,Cindy Hughes,Crack-free Moisture Performance Solution for 20mm*20mm*1.4mm TQFPs[J],The International Journal of Microcircuits and Electronic Packaging,1997,20(4):460. |
| [4] | S Luo,J Leisen,C P Wong,Fundamental Study on Moisture Absorption in Epoxy for Electronic Application[R],2001 Int'l Symposium on Electronic Packaging Technology,133 (2001). |
| [5] | P.Schmid,Plasma Deposition of Si-N and Si-O Passivation Layers on Three-Dimensional Sensor Devices[J],Surface and Coatings Technology,1998,98:1510. |
| [6] | J Li,Thermal Transition Effects and Electrochemical Properties in Organic Coatings: Part 1- Initial Studies on Corrosion Protective Organic Coatings [J],Corrosion,1998,54(10):763. |
| [7] | Michael G Pecht,Haleh Ardebili,Anald A Shukla,et al.,Moisture Ingress into Organic Laminates[J],IEEE Transactions on Components and Packaging Technology,1999,22(1):104. |
| [8] | 正交设计[M],北京大学数学系概率统计组编,北京:人民教育出版社1976,12. |
| [9] | Sung Yi,Jing Sua Goh,Ji Cheng Yang,Residual Stresses in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test[J],IEEE Trans.Comp.,Packag.,Manufact.Technol.,1997,20(3):247. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%