研究了Zn-Ni合金镀液中主盐的组成、电镀工艺参数对Zn-Ni合金镀层中的含镍量及镀层性能的影响,结果表明,电流密度是影响Zn-Ni合金镀层中含镍量的主要因素.在电沉积过程中,利用计算机控制电流输出的电镀电源,通过调整施镀电流密度,制备出了由2种组成不同的Zn-Ni合金薄层交替叠加而形成的Zn-Ni合金多层镀层.SEM表面及断面显微分析结果表明:Zn-Ni合金多层镀层表面无缺陷,断面呈清晰的层状结构.
参考文献
[1] | Despic A R,Jovic V D.Electrodeposition of laminar structures[J].J.Electrochem.Soc.,1987,134:3004. |
[2] | Ebrahimi F,Liscano A J.Microstructure/mechanical properties relationship in electrodeposited Ni/Cu nanolaminates[J].Material Science and Engineering,2001,A301:23. |
[3] | Lassri H,Ouahmane H.Ferromagnetic resonance studies of electrodeposited Ni/Cu multilayers[J].Thin Solid Films,2001,389:245. |
[4] | Yamada A,Houga T,Ueda Y.Magnetism and magnetoresistance of Co/Cu multilayer films produced by pulse control electrodeposition method[J].Journal of Magnetism and Magnetic Materials,2002,239:272. |
[5] | Gabe D R,Green W A.The mathematical modeling of CMA multilayered coatings[J].Surface and Coatings Technology,1998,105:195. |
[6] | Fei J Y,Liang G Z,Xin W L.The structure and protective properties of zincand nickel alternate electrodeposits[J].Transations of Materials and Heat Treatment,2004,25:1142. |
[7] | G D Wilcox.Surface modification with compositionally modulated multilayer coatings[J].Journal of Corrosion Science and Engineering,2003,6:126. |
[8] | Brenner A.Electrodeposition of Alloy[M].Vols.Ⅰ and Ⅱ,New York and London:Academic Press,1963.152 |
[9] | Roventi G,Fratesi R,Della R A,et al.Normal and anomalous co-deposition of Zn-Ni alloys from chloride bath[J].Journal of Applied Electrochemistry,2000,30:173. |
[10] | Kalantary M R,Wilcox G D,Gabe D R.The production of compositionally modulated alloys by simulated high speed electrodeposition from a single solution[J].Electrochimica Acta,995,40(11):1609. |
[11] | Short N R,Abibsi A,Nennis J K.Corrosion resistance of electroplated zinc alloy coatings[J],Trans.Inst.Met.Fin.,1984,67(1):73. |
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