氰酸酯近年来已成为热固性树脂的新门类,在电子工业和航天领域具有广泛的应用前景.本文对近年来氰酸酯的几种主要增韧技术的增韧机理和增韧方法进行了评述.如热塑性树脂共混改性、热固性树脂共混改性、橡胶弹性体增韧改性技术及纳米粒子增韧技术等.
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