采用超音速电弧喷射雾化制备Ag-28%Cu(质量分数)、Ag-10%Cu、Cu-10%Ag合金粉末;用SEM对合金粉末的凝固组织进行了研究.结果表明,Ag-10%Cu、Cu-10%Ag合金粉末的快速凝固组织为微晶胞离异共晶组织;粉末直径≤50μm时,Ag-28%Cu共晶粉末的快速凝固组织为单相亚稳固溶体;粉末直径＞50μm时,Ag-28%Cu共晶粉末的快速凝固组织为芯部含有纳米层片共晶组织的亚稳扩展固溶体.
参考文献
| [1] | Duwez P W;Willens R H .Rapid quenching of liquid alloys[J].Transactions of the Metallurgical Society of AIME,1963,227:262. |
| [2] | Boswell P G;Chadwick G A .The structure of the r'extended solid solution in a splat-cooled Ag-50at% Cu alloy[J].Journal of Materials Science,1977,12(09):1879-1894. |
| [3] | Thoma D J;Glasgow T K;Tewari S N .Effects of process parameters on melt-spun Ag-cu[J].Materials Science and Engineering,1988,98:89-93. |
| [4] | Jacobson N .Rapid solidification of Ag-Cu and Ag-Pb[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1991,133:574-576. |
| [5] | Boettinger W J;Shechtman D;Schaefer R J et al.The effect of rapid solidification velocity on the microstructure of Ag-Cu alloys[J].Metall Transaction A,1984,15(01):55-66. |
| [6] | Walder S;Ryder P L .Nonequilibrium solidification in undercooled melts of the alloy Ag-39.9at% Cu[J].Journal of Applied Physics,1993,73:1965-1970. |
| [7] | Walder S;Ryder P L .Critical solidification behavior of undercooled Ag-Cu alloys[J].Journal of Applied Physics,1993,74:6100-6106. |
| [8] | Pandey OP.;Ojha SN.;Mishra NS.;Lele S. .UNDERCOOLING AND SOLIDIFICATION OF DROPLETS OF CU-AG ALLOY ENTRAINED IN THE PRIMARY PHASE[J].Journal of Materials Science,1995(2):538-543. |
| [9] | 王汉功.超音速电弧喷涂技术[M].北京:国防工业出版社,1999 |
| [10] | 徐滨士,梁秀兵,马世宁.新型高速电弧喷涂枪的开发研究[J].中国表面工程,1998(03):16. |
| [11] | 陈永雄,徐滨士,许一,魏世丞,刘燕.高速电弧喷涂技术在装备维修与再制造工程领域的研究应用现状[J].中国表面工程,2006(z1):169-173. |
| [12] | 付东兴,徐滨士,李庆芬,张伟,魏世丞,陈永雄,白金元.高速电弧喷涂技术在防腐工程领域的研究现状[J].材料导报,2007(03):94-96,100. |
| [13] | 秦国义 .超音速电弧喷射雾化急冷银合金的性能与结构研究[D].昆明:昆明理工大学,2008. |
| [14] | Narayan J .Development of morphological instability and formation of cells in silicon alloys during pulsed-laser irradiation[J].Crystal Growth and Design,1982,59:583. |
| [15] | 宁远涛,张晓辉,秦国义,张婕.不同凝固条件制备的Cu-Ag合金原位纤维复合材料的结构与性质[J].贵金属,2005(03):39-50. |
| [16] | Aziz M J .Model for solute redistribution during rapid solidification[J].Journal of Applied Physics,1982,53(02):1158-1168. |
| [17] | White C W;Peercy P S.Laser and electron-beam interactions with solids[A].North-holland,1982:241. |
| [18] | Mullins W W;Sekerka R F .Stability of a planar interface during solidification of a dilute alloy[J].Journal of Applied Physics,1964,35:444-451. |
| [19] | Carrard M;Gremaud M;Zimmermann M et al.About the banded structure in rapidly solidified dendritic and eutectic alloys[J].Acta Metallurgica Et Materialia,1992,40(05):983-996. |
| [20] | 周尧和;胡壮麒;介万奇.凝固技术[M].北京:机械工业出版社,1998:252. |
| [21] | Jones H .Modelling of growth and microstructure selection in rapid solidification[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1991,133:33-39. |
| [22] | Elliott R P;Shunk F A .The Silver-Copper System[J].Bulletin of Alloy Phase Diagrams,1980,1(01):41-45. |
| [23] | Murray J .The metastable phase diagram for the Ag-Cu system[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1984,15:261-268. |
| [24] | 宁远涛;赵怀志.银[M].长沙:中南大学出版社,2005:102-125. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%