本文综述了近10年来化学镀可焊性锡基合金的研究现状及动态。列举了4种不同镀液体系的典型配方及工艺，并对化学镀锡合金的未来发展提出了建议。
Current status and prospect of solderable electroless tin alloy plating were summarized with 18 references published in the recent decade. Four traditional plating solutions based on chloride, fluoboric, alkyl sulfonate and ethane sulfonate were exemplified. Suggestions were presented about the develoment of electroless plating of solderable tin alloy.
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