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金镀层具有优良的各项性能,采用合金化镀金可进一步提高镀金层的硬度和耐磨性.本文介绍了镀金工艺的分类,比较了几种常用镀金工艺如金钴、金镍和金铁合金的特点及应用.

参考文献

[1] 洛温海姆.现代电镀[M].北京:机械工业出版社,1982:271-294.
[2] 屠振密.电镀合金原理与工艺[M].北京:国防工业出版社,1993
[3] 丸山清;毛利秀明.功能电镀[M].上海:上海科学技术文献出版社,1988:181-234.
[4] Hisao KUMAKURA;Makoto SEKIGUCHI .Increase in Contact Resistance of Hard Gold Plating during Thermal Aging - Nickel-Hardened Gold and Cobalt-Hardened Gold -[J].IEICE transactions on electronics,1999(1):13-18.
[5] Morton Antier.The tribology of contact finishes for electronic connectors:Mechanisms of friction and wear[J].Plating and Surface Finishing,1988(10):46-53.
[6] Morton Antier.The tribology of contact finishes for electronic connectors:The effects of underplate, topography and lubrication[J].Plating and Surface Finishing,1988(11):28-32.
[7] 郑关林.镀金层盐雾试验机理及方法探讨[J].电镀与精饰,1999(06):11-14.
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