金镀层具有优良的各项性能,采用合金化镀金可进一步提高镀金层的硬度和耐磨性.本文介绍了镀金工艺的分类,比较了几种常用镀金工艺如金钴、金镍和金铁合金的特点及应用.
参考文献
[1] | 洛温海姆.现代电镀[M].北京:机械工业出版社,1982:271-294. |
[2] | 屠振密.电镀合金原理与工艺[M].北京:国防工业出版社,1993 |
[3] | 丸山清;毛利秀明.功能电镀[M].上海:上海科学技术文献出版社,1988:181-234. |
[4] | Hisao KUMAKURA;Makoto SEKIGUCHI .Increase in Contact Resistance of Hard Gold Plating during Thermal Aging - Nickel-Hardened Gold and Cobalt-Hardened Gold -[J].IEICE transactions on electronics,1999(1):13-18. |
[5] | Morton Antier.The tribology of contact finishes for electronic connectors:Mechanisms of friction and wear[J].Plating and Surface Finishing,1988(10):46-53. |
[6] | Morton Antier.The tribology of contact finishes for electronic connectors:The effects of underplate, topography and lubrication[J].Plating and Surface Finishing,1988(11):28-32. |
[7] | 郑关林.镀金层盐雾试验机理及方法探讨[J].电镀与精饰,1999(06):11-14. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%