介绍了各种离子型活化工艺,如ABS-Pd2+活化、Pd2+-HD-1活化、银离子型活化和钯离子型活化等.ABS-Pd2+活化是Pd2+和ABS经粗化后的表面活性基团直接络合,Pd2+-HD-1活化是以有机碱HD-1为络合剂,银离子型活化一般以氨为络合剂,钯离子型活化以Cl-为络合剂.提出了银离子型和钯离子型2种活化液的配制方法、活化机理.同时从活化机理、稳定性等方面比较了胶体钯活化液和离子型活化液.
参考文献
[1] | 吴连波,张伟.塑料的金属化工艺[J].吉林工学院学报(自然科学版),2002(01):27-30. |
[2] | Emil A B;Skarsatra;Lidingo et al.Surface metallizing method[P].US 2702253,1955. |
[3] | Charles R S;Newton;Mass .Method of electroless deposition on a substrate and catalyst solution therefor[P].US 3011920,1959. |
[4] | Joshi;Nayan E;Caskie;John E, et al.Composition and process for treating a surface coated with a self-accelerating and replenishing nonformaldehyde immersion coating[P].US 5725640,1998. |
[5] | Shirota;Hideki;Okada et al.Method of electroplating non-conductive plastic molded products[P].US 6331239,2001. |
[6] | Schrott AG.;Osullivan EJM.;Saraf RF.;Bailey P.;Roldan J.;Braren B. .LASER-ASSISTED SEEDING FOR ELECTROLESS PLATING ON POLYIMIDE SURFACES[J].Journal of the Electrochemical Society,1995(3):944-949. |
[7] | 李宁.化学镀实用技术[M].北京:化学工业出版社,2004:147-148. |
[8] | 伍学高.塑料电镀技术[M].成都:四川科学技术出版社,1983:191-193. |
[9] | Jackson R L .[J].Journal of the Electrochemical Society,1990,137:95. |
[10] | Yen PC. .IMPROVED ABS PLASTIC ACTIVATING TREATMENT FOR ELECTROLESS COPPER PLATING[J].Polymer,1995(17):3399-3400. |
[11] | 邝少林.化学镀第三代活化工艺的研究--离子型钯活化液[J].材料保护,1986(03):13. |
[12] | Touyeras F.;Hihn JY.;Delalande S.;Viennet R.;Doche ML. .Ultrasound influence on the activation step before electroless coating[J].Ultrasonics sonochemistry,2003(6):363-368. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%