铜箔是制造印制板的关键性导电材料,它的性能与其表面处理工艺密切相关.着重介绍了一些常用的电解铜箔表面处理工艺规范和镀层特点,概述了当前铜箔表面处理工艺包括高温耐热表面处理、双面铜箔表面处理、超薄铜箔表面处理、高抗张性铜箔表面处理和高频电路用铜箔表面处理等工艺的研究现状.展望了印制板用铜箔的发展趋势.
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