欢迎登录材料期刊网

材料期刊网

高级检索

根据国内外电沉积金属基复合镀层的研究结果,综述了微粒特性、镀液组成、工艺条件以及其它因素对复合电沉积的影响.提出今后应继续加强在复合电沉积机理方面的研究,以便更深刻、更准确地理解和掌握复合电沉积的各种影响因素,从而更好地对复合电沉积的工艺研究和应用给予指导.

参考文献

[1] 郭鹤桐;张三元.复合镀层[M].天津:天津大学出版社,1991
[2] 钟诚.复合电镀的研究新进展[J].四川化工,2004(01):16-19.
[3] 常立民,安茂忠,石淑云.复合镀研究的新进展[J].吉林师范大学学报(自然科学版),2005(02):13-16.
[4] 王周成,倪永金,唐毅.电化学方法制备金属基复合材料研究进展[J].材料导报,2006(07):51-53,57.
[5] 周白杨,高诚辉.镍-铁-磷/金刚石复合沉积工艺与性能研究[J].材料保护,2006(02):25-28.
[6] 陈玉梅,左正忠,杨磊,王志军.表面活性剂对电沉积镍/纳米二氧化钛复合层的影响[J].表面技术,2005(05):22-25.
[7] 周海飞,杜楠,赵晴.复合电沉积工艺研究现状[J].电镀与涂饰,2005(06):41-46.
[8] Sun Kyu Kim;Hong Jae Yoo .Formation of bilayer Ni-SiC composite coatings by electrodeposition[J].Surface & Coatings Technology,1998(1/3):564-569.
[9] 白晓军.复合电镀[J].化工腐蚀与防护,1992(02):30-34.
[10] 赵芳霞,罗驹华,张振忠,陈传文.Ni-P-纳米TiO2复合镀层的耐蚀性研究[J].特种铸造及有色合金,2005(05):262-264.
[11] Wang SC.;Wei WCJ. .Kinetics of electroplating process of nano-sized ceramic particle/Ni composite[J].Materials Chemistry and Physics,2003(3):574-580.
[12] 孙伟,张覃轶,叶卫平,黄尚宇.纳米复合电沉积技术及机理研究的现状[J].材料保护,2005(06):41-44.
[13] 屠振密,胡会利,于元春,高鹏.电沉积纳米晶材料制备方法及机理[J].电镀与环保,2006(04):4-8.
[14] 王积森,温红,孙金全,张国松.纳米材料在复合电沉积中的应用[J].电镀与涂饰,2006(01):59-62.
[15] CELIS J P .A mathematical model for the electrolytic codeposition of particles with a metallic matrix[J].Journal of the Electrochemical Society,1987,134(06):1402-1408.
[16] 郭会清,方红,禹建鹰.复合镀中分散微粒共沉积的若干问题探讨[J].中原工学院学报,2002(01):29-31.
[17] PERIENE N;CESUNIENE A;MATULIONIS E .Codeposition of mixtures of dispersed particles with nickel-phosphorus electrodeposits[J].Plating and Surface Finishing,1994,81(10):68-71.
[18] PUSHPAVANAM M;SHENOI B A .Nickel-aluminum oxide composite coatings[J].Metal Finishing,1977,75(04):38-43.
[19] ZHANG Y J;FAN Y Y;YANG X W et al.Study on process and mechanism of electrodeposited Zn-Fe-SiO2 composite coating[J].Plating and Surface Finishing,2004,91(09):39-43.
[20] 范云鹰,张英杰,杨显万,陈阵,章江洪,屠振密.镀液组成对Zn-Fe-SiO2合金复合镀层成分的影响[J].表面技术,2003(05):53-55.
[21] 黎德育,李宁,杜明华,武刚,刘向.氨基磺酸盐复合镀Ni-Al2O3[J].材料科学与工艺,2004(02):199-201.
[22] GARCIA I;CONDE A;LANGELAAN C et al.Improved corrosion resistance through microstructural modification induced by codepositing SiCparticles with electrolytic nickel[J].Corrosion Science,2003,45(06):1173-1189.
[23] Wu G.;Li N.;Zhou DR.;Mitsuo K. .Electrodeposited Co-Ni-Al2O3 composite coatings[J].Surface & Coatings Technology,2004(2):157-164.
[24] 舒余德,邓朝阳,谢勤.(Zn-Co)-TiO2复合电镀的工艺研究[J].电镀与精饰,2000(06):12-16.
[25] BERKH O;BODNEVAS A;ZAHAVI J .Efrect of additives on electrodeposition of composite chromium coatings[J].Plating and Surface Finishing,1994,81(03):62-64.
[26] O. Berkh;A. Bodnevas;J. Zahavi .Electrodeposited Ni-P-SiC Composite Coatings[J].Plating & Surface Finishing,1995(11):62-66.
[27] BERKH O;ESKIN S;BERNER A et al.Electrochemical Cr-Ni-Al2O3 composite coatings Part I:some aspects of the codeposition process[J].Plating and Surface Finishing,1995,82(01):54-59.
[28] Wang YL.;Zhao SM.;Tao HM.;Dong XH.;Wan YZ. .Electrodeposition and characterization of Al2O3-Cu(Sn), CaF2-Cu(Sn) and talc-Cu(Sn) electrocomposite coatings[J].Surface & Coatings Technology,1998(2/3):162-166.
[29] CELIS J P .Kinetics of the deposition of alumina particles from copper sulphate plating baths[J].Journal of the Electrochemical Society,1977,124(10):1508-1511.
[30] 王丽琴,吴化,赵宇.铜基表面Ni-Si3N4纳米复合镀工艺研究[J].表面技术,2004(01):42-44.
[31] 李丽华;吴继勋;张海冬 等.Zn-SiO2复合镀工艺研究[J].电镀与涂饰,1995,14(03):31-33.
[32] 刘贵昌.复合镀层的沉积规律和憎液性[J].材料保护,1997(09):1.
[33] 李丽华.表面活性剂对高速Zn-SiO2复合镀层的影响[J].电镀与精饰,1996(01):8.
[34] 陈亚;李士嘉;王春林.现代实用电镀技术[M].北京:国防工业出版社,2003
[35] TOMASZEWSKI T W .Codeposition of finely dispersed particles with metals[J].Plating,1969,56(10):1234-1239.
[36] SNAITH D W .Some further studies of the mechanism of cermet electrodeposition:Pt 1-The effect of electrolyte on the charge carried by a suspended ceramic particle[J].Transactions of the Institute of Metal Finishing,1977,55(03):136-140.
[37] WHITE C .Factors affecting the entrapment of alumina particles during the electrodeposition of copper[J].Transactions of the Institute of Metal Finishing,1981,59:8-12.
[38] 张海冬.硝酸钠在Zn-SiO2高速电镀中的作用[J].材料保护,1996(01):10.
[39] 周永令.锌基复合镀工艺在我厂的应用[J].电镀与精饰,1995(01):9.
[40] 郭忠诚;杨显万.电沉积多功能复合材料的理论与实践[M].北京:冶金工业出版社,2002
[41] 武刚,李宁,王殿龙,周德瑞.α-Al2O3与Co-Ni合金电化学共沉积动力学模型[J].物理化学学报,2003(11):996-1000.
[42] 徐龙堂,徐滨士,马世宁,周美玲.电刷镀镍基Ni包纳米Al2O3粉复合镀层的组织性能[J].兵器材料科学与工程,2000(04):7-11,50.
[43] 郭鹤桐;舒钰;唐致远.金属陶瓷复合材料的电沉积[J].电镀与环保,1982(03):4-8.
[44] 张英杰,范云鹰,杨显万,陈阵,章江洪,屠振密.工艺条件对Zn-Fe-SiO2复合镀层成分的影响[J].材料保护,2004(05):26-27,44.
[45] SHRESTHA N R;MASUKO M;SAJI T .Composite plating of Ni/SiC using azo-cationic surfactants and wear resistance of coating[J].Wear,2003,254:555-564.
[46] 古川直治 .Factors affecting the formation of Ni-Al2O3 and Ni-ZrO2 dispersion coatings[J].金属表面技术(日本),1977,28(10):527-533.
[47] 杜克勤,陈慧光,李娟,程国伟.镍-聚四乙烯复合电沉积机理的研究[J].大连铁道学院学报,2001(03):96-100.
[48] 彭群家.Ni/ZrO2复合电沉积机理的研究[J].电化学,1999(01):68.
[49] 方莉俐,张兵临,姚宁.搅拌对金刚石-金属复合薄膜电沉积结果的影响及流体力学分析[J].金刚石与磨料磨具工程,2005(02):18-20.
[50] 薛伯生.间歇搅拌对铁基复合镀层中微粒含量的影响[J].材料保护,2000(03):9-10.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%