高能球磨过程中的温度效应一直是研究者们争论的焦点,这直接影响到对机械合金化机制的认识.作者以两种具有高放热性质的Al/CuO和Si/CuO体系为研究对象,考察了环境温度(11、22、100、200℃)对高能球磨固态还原反应的影响,试验结果表明:(1)Al/CuO和Si/CuO体系反应开始的时间均随环境温度升高而缩短,归因于提高环境温度增强了球磨固态原子或离子的扩散速率;(2)球磨中间停留将延长开始反应时间,这是因为停留使反应体系能量降低,恢复球磨需要一段时间来重新建立点火所需条件所致.
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