基于固体与分子经验电子理论(EET),对Cu及Cu-Zn合金固溶体的价电子结构进行分析.计算一组表征金属和合金相性质的价电子结构参数统计值n'_A,E'_A,研究价电子结构参数σN与合金稳定性的关系.计算结果表明,Cu的统计值n'_A,E'_A与相应的最可几值n_A,E_A,的计算偏差分别为5.72%和6.86%;Zn原子的加入,提高Cu晶胞中最强共价键的结合能力,使n'_A由0.353 937增大到0.391 175,起到了固溶强化作用;同时,Zn原子溶入,使σ_N急剧增大,增强基体的稳定性.
Based on the empirical electron theory of solid and molecules (EET), the valence electron structures of Cu and Cu-Zn alloy solid solution are analyzed, and a set of statistical values of valence electron structure parameters n'_A and E'_A which can characterize the properties of metals and alloy phases are calculated, the relationship between the valence electron structure parameter σ_N and the stability of alloys is studied. The results show that the calculation deviations of statistical values n'_A and E'_A, with the corresponding most probable value n_A and E_A of Cu are 5.72% and 6.86%. The binding ability of the strongest covalent bond in the Cu cell with the statistical n'_A from 0.353 937 to 0.391 175 is enhanced, and plays a solid solution strengthening effect. At the same time, with the Zn atoms joining, the σ_N value increases dramatically, and the stability of the matrix enhances.
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