在微电子器件封装第一级互连技术中,丝球焊技术占据着重要地位.随着封装技术的不断发展以及铜芯片技术的逐步应用,铜丝球焊技术开始部分替代金丝球焊应用在一些分立器件、大功率器件等电子元器件的封装中,并在精密封装领域得到推广和应用.本文主要对近年来铜丝球焊技术的相关研究进行了综述,介绍了铜丝球焊技术的发展现状.
参考文献
| [1] | NACHON B .The basics of ball bonding[EB/OL].http://www.kns.com/Templates/showpage.asp?TMID=111&FID=114&PID=14141,2004. |
| [2] | KIM H J;LEE J Y;PAIK K W et al.Effects of Au/Al intermetallic compound on copper wire and Aluminum pad bondability[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2003,26(02):367-374. |
| [3] | S. Murali;N. Srikanth;Charles J. Vath III .Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding[J].Materials Characterization,2003(1):39-50. |
| [4] | HARMAN G G.Wire Bonding in Microelectronics[M].McGraw-Hill Publishing,1997 |
| [5] | Khoury S.L.;Burkhard D.J. .A comparison of copper and gold wire bonding on integrated circuit devices[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(4):673-681. |
| [6] | MNOUZ L .The use of copper wire as an alternative interconnection material in advanced semiconductor packaging[EB/OL].http://www.kns.com/knsnew/library/articles.htm,1999-11-02. |
| [7] | Nguyen L.T.;McDonald D. .Optimization of copper wire bonding on Al-Cu metallization[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1995(2):423-429. |
| [8] | Toyozawa K.;Fujita K. .Development of copper wire bonding application technology[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(4):667-672. |
| [9] | CAERS J F J M;BISCHOFF A;FALK J.Conditions for reliable ball-wedge copper wire bonding[A].,1993:312-315. |
| [10] | H.K. Charles;K.J. Mach;S.J. Lehtonen;A.S. Francomacaro;J.S. DeBoy;R.L. Edwards .Wirebonding at higher ultrasonic frequencies: reliability and process implications[J].Microelectronics and reliability,2003(1):141-153. |
| [11] | LAM K W;HO H M;STOUKATCH S.Fine pitch copper wire bonding on copper bond pod processoptimization[A].,2002:63-68. |
| [12] | SHEAFFER M;CHYLAK R .Using copper materials in semiconductor packaging[EB/OL].http://www.kns.com/knsnew/library/articles.htm,2001-10. |
| [13] | SIBAKUMAR M;KRIPESH V;LIM L A.Fine pitch copper wire bond process development for dual damascene Cu metalized chips[A].,2002:350-355. |
| [14] | W. Qin;R. Doyle;T. Scharr;M. Shah;M. Kottke;G. Chen;D. Theodore .Surface oxide evolution on Al-Si bond wires for high-power RF applications[J].Microelectronic engineering,2004(1):111-116. |
| [15] | Y. F. Chong;R. Gopalakrishnan;C. F. Tsang;G. Sarkar;S. Lim;S. Tatti .An investigation on the plasma treatment of integrated circuit bond pads[J].Microelectronics and reliability,2000(7):1199-1206. |
| [16] | Hong Meng Ho;Wai Lam;Serguei Stoukatch;Petar Ratchev;Charles J. Vath Ⅲ;Eric Beyne .Direct gold and copper wires bonding on copper[J].Microelectronics and reliability,2003(6):913-923. |
| [17] | HARMAN G G;JOHNSON C E .Wire bonding to advanced copper-low-k integrated circuits,the metal/dielectric stacks,and material considerations[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2002,25(04):677-683. |
| [18] | S. Ramminger;P. Turkes;G. Wachutka .Crack mechanism in wire bonding joints[J].Microelectronics and reliability,1998(6-8):1301-1305. |
| [19] | TOMLINSON W J;WINKLE R V .Effect of heat treatment on the shear strength and fracture modes of copper wire thermosonic ball bonds to Al-1% Si device metallizatlon[J].IEEE Transactions on Components Hyhrids and Manufacturing Technology,1990,13(03):587-591. |
| [20] | C. W. Tan;A. R. Daud .Bond pad cratering study by reliability tests[J].Journal of Materials Science. Materials in Electronics,2002(5):309-314. |
| [21] | Onuki J.;Koizumi M. .Investigation on enhancement of copper ball bonds during thermal cycle testing[J].IEEE transactions on components, hybrids, and manufacturing technology,1991(2):392-395. |
| [22] | COHEN I M;HUANG L J;AYYASWAMY P S .Melting and solidification of thin wires:A Class of phasechange problems with a mobile interface-Ⅱ.Experimental confirmation[J].International Journal of Heat and Mass Transfer,1995,38(09):1647-1659. |
| [23] | HUANG L J;AYYASWAMY P S;COHEN I M .Melting and solidification of thin wires:A Class of phasechange problems with a mobile interface-Ⅰ.Analysis[J].International Journal of Heat and Mass Transfer,1995,38(09):1637-1645. |
| [24] | HUGHES D;HANSEN N.A comparison of the evolution of cold and hot deformation microstructures and textures in FCC metals[A].,1994:427-444. |
| [25] | HANSEN N .Cold deformation microstructures[J].Materials Science and Technology,1990,6:1039-1047. |
| [26] | Srikanth N;Murali S;Wong YM;Vath CJ .Critical study of thermosonic copper ball bonding[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(0):339-345. |
| [27] | S.Murali;N.Srikanth;Charles J.Vath III .An analysis of intermetallics formation of gold and copper ball bonding on thermal aging[J].Materials Research Bulletin: An International Journal Reporting Research on Crystal Growth and Materials Preparation and Characterization,2003(4):637-646. |
| [28] | S. Murali;N. Srikanth;C.J. Vath III .Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds[J].Materials Letters,2004(25):3096-3101. |
| [29] | ONUKI J;KOIZUMI M .Investigation of the reliability of copper ball bonds to aluminum electrodes[J].IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1987,12(04):550-555. |
| [30] | HANG C J;WANG C Q;MAYER M.Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging[J].Microelectronics Reliability,2007(08) |
| [31] | Tan CW.;Daud AR.;Yarmo MA. .Corrosion study at Cu-Al interface in microelectronics packaging[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(1/4):67-73. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%