为了获得具有良好微观组织的C-Cu复合粉末,以利于后续的压制、烧结和挤压等工艺,用机械球磨方法制备了3%C-Cu(质量分数)复合粉末.运用扫描电镜、背散射和X射线衍射等分析手段研究了该复合粉末的微观组织随球磨时间的演变规律.实验结果表明,随着机械球磨时问的增加,Cu颗粒由树枝状转变为层片状、块状,最后转变为近球形.球磨2 h,复合粉末中的石墨衍射峰消失.随着球磨的进行,复合粉末中Cu的微观应变逐渐增大.经3 h的机械球磨获得了晶粒尺寸约为20 nm的Cu纳米晶,说明该方法可以有效地细化晶粒组织.
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