在考察镀覆条件对镀层含磷量影响的基础上,用电化学方法评价不同含磷量镀层的耐蚀性,得到基本一致的结果:镀液温度及pH值降低,镀层磷含量升高,而镀层含磷量的提高又使镀层的耐蚀性提高.用SEM、EDAX和XRD研究了镀层的表面和断面形貌、含磷量以及相结构,探讨了碳化硅颗粒增强铝基(SiCp/Al)复合材料表面化学镀镍层耐腐蚀的机理.结果表明,在腐蚀过程中,镀层中磷元素在表面富集形成具有良好耐蚀性的钝化膜,从而提高镀层的自钝化能力和耐蚀性.
参考文献
[1] | Moustafa S F;Abdel-Hamid Z;Abd-Elhay A M .Aluminum matrix SiC and Al2O3 particulate composites are manufactured by powder metallurgy technique[J].Materials Letters,2002,53(4-5):244-249. |
[2] | Kevin A M;Yogendra K J.High performance packaging materials and architectures for improved thermal management of power electronics[J].Future Circuits International,2001(07):45-49. |
[3] | 武高辉,张强,姜龙涛,陈国钦,修子扬.SiCp/Al复合材料在电子封装应用中的基础研究[J].电子元件与材料,2003(06):27-29. |
[4] | Johnston C;Young R .Advanced thermal management materials[J].Proceedings of the IEEE Micro Electro Mechanical Systems(MEMS),2000,2(01):14-15. |
[5] | Zhang Q;Xiu Z Y;Song M H et al.Microstructure and properties of a 70vol.% SiCp/Al-12Si composite for electronic packaging[J].Materials Science Forum,2005,475-479:881-884. |
[6] | Kong FZ.;Zhang XB.;Xiong WQ.;Liu F.;Huang WZ.;Sun YL.;Tu JP.;Chen XW. .Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method[J].Surface & Coatings Technology,2002(1):33-36. |
[7] | Huang CY.;Mo WW. .The effect of attached fragments on dense layer of electroless Ni/P deposition on the electromagnetic interference shielding effectiveness of carbon fibre/acrylonitrile-butadiene-styrene composites[J].Surface & Coatings Technology,2002(1):55-62. |
[8] | 张邦维,谢浩文.化学镀制备Ni-Sn-Cu-P合金非晶形成能力[J].稀有金属材料与工程,1998(02):79-83. |
[9] | 刘新宽,向阳辉,胡文彬,丁文江.镁合金化学镀镍层的结合机理[J].中国腐蚀与防护学报,2002(04):233-236. |
[10] | 李淑华;李宝彦;张九龙 .化学沉积镍磷粉晶态合金沉积过程及耐蚀性的研究[J].材料科学与工艺,1994,2(01):39-43. |
[11] | Jin JG;Lee SK;Kim YH .Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(1/2):272-278. |
[12] | Daisuke Niwa;Nao Takano;Taro Yamada;Tetsuya Osaka .Nickel electroless deposition process on chemically pretreated Si(100) wafers in aqueous alkaline solution[J].Electrochimica Acta,2003(9):1295-1300. |
[13] | M. H. Staia;E. S. Puchi;G. Castro;F. O. Ramirez;D. B. Lewis .Effect of thermal history on the microhardness of electroless Ni-P[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1999(0):472-479. |
[14] | 刘仙,班春燕.化学镀Ni-P合金工艺及镀层耐蚀性的研究[J].钢铁研究,2002(05):35-38. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%