对先驱体硅树脂高温(800~1400℃)转化陶瓷接头连接石墨、SiC陶瓷及Cf/SiC复合材料进行了研究,着重对硅树脂固化裂解过程、硅树脂溶液浓度、裂解温度及惰性填料对连接性能的影响进行了探讨.研究表明,硅树脂的交联固化主要是通过消耗Si-OH来完成,先驱体溶液的浓度及裂解温度根据基材的不同而有不同影响,适当加入惰性填料SiC可以提高硅树脂对Cf/SiC复合材料的连接性能.
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