采用低压化学气相沉积(LPCVD)法制备了具有热解碳界面层的2.5维SiC/SiC复合材料.研究了残余孔洞及热解碳界面层厚度对材料力学性能的影响.结果表明:材料弯曲强度受纤维束之间大孔的影响很小,主要与纤维间的小孔有关,随小孔尺寸和数量的减小而增大.当气孔率低于27%时,小孔的数量和尺寸均变化不大,材料强度提高有限.90nm厚热解碳界面层的存在使材料由破坏性断裂变为非破坏性断裂,强度由174MPa增加到305MPa.进一步增加界面层厚度,纤维受到损伤,材料的力学性能下降.界面层为180nm和310nm厚时SiC/SiC的强度分别为274MPa和265MPa,纤维拔出数量少,材料近似破坏性断裂.
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