采用金相显微镜(OA)、扫描电镜( SEM)、透射电镜(TEM)、差示扫描量热法(DSC)、拉伸测试等方法研究了固溶处理对含Ag的Al-Cu-Mg合金力学性能与组织的影响.结果表明:合金的最佳固溶工艺为:515℃/1.5 h.185℃时效处理4h后,合金的抗拉强度为503 MPa,伸长率为12.3％.在510 ～ 525℃进行固溶处理,随固溶温度升高和固溶时间延长,合金的强度先逐渐升高,当固溶温度超过515℃(保温2h)或固溶时间大于1.5h(固溶温度为515℃)时,合金强度逐步降低.固溶温度过低或时间过短不利于过剩相回溶,使合金强度降低,而固溶温度过高或时间过长,则容易过烧.合金的过烧温度为525.9℃.固溶温度对合金的力学性能和显微组织的影响要比固溶时间更加明显.
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