利用搅拌摩擦焊对SiCp/2024Al铝基复合材料进行了焊接.采用急停实验分析母材瞬间移动行为.利用金相显微镜,TEM观察接头组织.接头显微组织分析表明,接头中形成V字型结构,且SiC颗粒因焊缝位置不同而分布不均匀.在热机影响区中,SiC出现偏析;在焊核区,SiC颗粒较少.若参数选择不当,焊核中心区出现了颗粒消失现象.焊缝不同位置透射电镜分析表明,SiC/Al界面结合清晰,无脆性相生成,并在其中发现了破碎的SiC颗粒.
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