采用脉冲和直流电流制备Ni-Co合金电铸层.采用显微硬度计、能谱仪、扫描电镜(SEM)和X射线衍射仪测试并观察铸层的显微硬度、钴含量和微观结构.结果表明:利用脉冲电流和直流电流制备的铸层显微硬度均较高,且铸层的显微硬度随电流密度(Dk)增大而呈下降趋势.但脉冲电流制备的铸层硬度下降趋势较直流电流制备的铸层下降缓慢.铸层钴含量随着电流密度(Dk)的增大而减少,脉冲电流制备的铸层钴含量下降较缓.电源类型对铸层表面形貌影响较大.采用脉冲电流,铸层晶包均匀,呈菜花包状;采用直流电流,铸层晶粒分布不均匀,呈块状.与直流电流相比,脉冲电流对铸层微观结构影响不大.
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