环保要求和微电子器件的高度集成化驱动了高性能无铅焊料的研究和开发,近年来,Sn-Zn基无铅钎料因熔点与SnPb相近,成本低廉和机械性能优良等优点而备受关注,但是焊料的差异和焊接工艺参数的调整给焊点的可靠性带来了新的影响.本文总结了SnZn系焊料的主要失效模式,重点围绕热疲劳与机械疲劳、焊料和基体界面金属间化合物形成致裂、腐蚀等问题,阐述了SnZn系无铅焊料的可靠性,并指出提高其连接可靠性的几个途径.
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