降低陶瓷与陶瓷或金属连接温度的技术

宇航材料工艺 , 2002, 32(6): 1-13. doi: 10.3969/j.issn.1007-2330.2002.06.001

降低陶瓷与陶瓷或金属连接温度的技术

邹贵生 ^1, , 杨俊 ^2, , 吴爱萍 ^3, , 巫世杰 ^4, , 顾兆旃 ^5,

1.清华大学机械工程系,北京,100084

2.清华大学机械工程系,北京,100084

3.清华大学机械工程系,北京,100084

4.航天材料及工艺研究所,北京,100076

5.航天材料及工艺研究所,北京,100076

基金项目: 国家自然科学基金(50 075 046) 航天科技创新项目清华大学校科研和教改项目

关键词：陶瓷 , 低温连接 , 过渡液相扩散连接 , 半固态连接 , 表面改性

Techniques for Lowering The Bonding Temperature in Ceramic to Ceramic or Metal Bonding Research

为降低陶瓷与陶瓷或金属的连接温度,目前采用的连接方法有过渡液相扩散连接、半固态连接、机械连接、粘接、铟封和陶瓷表面低温改性后低温钎焊等.本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状.

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降低陶瓷与陶瓷或金属连接温度的技术

Techniques for Lowering The Bonding Temperature in Ceramic to Ceramic or Metal Bonding Research

参考文献