在分析单晶硅片的典型加工工艺基础上,介绍了基于工件旋转式磨削法的大直径硅片超精密加工技术的原理及特点,综述了该项技术的试验研究进展及建立的数学模型,分析了有限元法在工件旋转式磨削硅片研究中的应用,最后提出了工件旋转式磨削大直径硅片技术目前存在的问题和今后的发展趋势.
参考文献
| [1] | Jakubowski A;Lukasial L;Jurczak M.Silicon microelectronics for speed[A].USA.Allied pub.Ltd,2000:297-302. |
| [2] | Tricard M;Kassir S;Heron P.New abrasive trends in manufacturing of silicon wafers[A].,1998:165-170. |
| [3] | Online Staff.Silicon shipments,revenues rise[J].Electronics News,2005 |
| [4] | Online Staff.Global semi sales hit record high[J].Electronics News,2005 |
| [5] | Francesca Illuzzi .Silicon Wafer Requirements for ULSI Device Processing[J].Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena,2002(0):1-6. |
| [6] | 蒋荣华,肖顺珍,张建新,杨卫东.新世纪国内外半导体硅材料的新发展[J].新材料产业,2004(03):30-38. |
| [7] | Hahn P O .The 300mm silicon wafer-A cost and technology[J].Microelectronic Engineering,2001,56(02):3-13. |
| [8] | [OL].http://www.itrs.net/Common/2004Update/2004Update.htm |
| [9] | Bawa S;Petro E F;Grimes H M .Fracture strength of large diameter silicon wafer[J].Semiconductor International,1995,18(03):115-118. |
| [10] | Fukaml T;Masumura H;Suzuki K et al.Method of manufacturing semiconductor mirror wafers[P].EP 0782179A2,1997-07-27. |
| [11] | Tonshoff H K;Schmieden W V;Inasaki I et al.Abrasive machining of silicon[J].Annals of the CIRP,1990,39(02):621-630. |
| [12] | Z. J. Pei;Graham R. Fisher;Milind Bhagavat;S. Kassir .A grinding-based manufacturing method for silicon wafers: an experimental investigation[J].International Journal of Machine Tools & Manufacture: Design, research and application,2005(10):1140-1151. |
| [13] | Matsui S .An experimental study on the grinding of silicon wafer-the wafer rotation grinding method (1st report)[J].Bulletin Japan Society Prec Eng,1988,22(01):295-300. |
| [14] | Wangping Sun;Z. J. Pei;G. R. Fisher .Fine grinding of silicon wafers: effects of chuck shape on grinding marks[J].International Journal of Machine Tools & Manufacture: Design, research and application,2005(6):673-686. |
| [15] | Bifano T G;Dow T A;Seattergood R O .Ductile-regime grinding:a new technology for machining brittle materials[J].Journal of Engineering for Industry-Transactions of the ASME,1991,113(02):184-189. |
| [16] | 郭东明,康仁科,金洙吉.大尺寸硅片的高效超精密加工技术[J].世界制造技术与装备市场,2003(01):35-40. |
| [17] | Ohmori H;Nakagawa T .Mirror surface grinding of silicon wafers with electrolytic in-process dressing[J].Annals of the CIRP,1990,39(01):329-332. |
| [18] | Z. J. Pei;S. R. Billingsley;S. Miura .Grinding induced subsurface cracks in silicon wafers[J].International Journal of Machine Tools & Manufacture: Design, research and application,1999(7):1103-1116. |
| [19] | Z. J. Pei;Alan Strasbaugh .Fine grinding of silicon wafers[J].International Journal of Machine Tools & Manufacture: Design, research and application,2001(5):659-672. |
| [20] | Z. J. Pei;Alan Strasbaugh .Fine grinding of silicon wafers: designed experiments[J].International Journal of Machine Tools & Manufacture: Design, research and application,2002(3):395-404. |
| [21] | Pei Z J .A study on surface grinding of 300 mm wafers[J].International Journal of Machine Tools and Manufacture,2002,42(03):385-393. |
| [22] | 田业冰,郭东明,康仁科,金洙吉.大尺寸硅片自旋转磨削的试验研究[J].金刚石与磨料磨具工程,2004(04):1-4. |
| [23] | Chidambaram S;Pei Z J;Kassir S .Fine grinding of silicon wafers:a mathematical model for the chunk shape[J].International Journal of Machine Tools and Manufacture,2003,43(07):739-746. |
| [24] | Chidambaram S;Pei Z J;Kassir S .Fine grinding of silicon wafers:a mathematical model for grinding marks[J].International Journal of Machine Tools and Manufacture,2003,44(01):11-19. |
| [25] | Sun W P;Pei Z J;Fisher G R .Fine grinding of silicon wafers:a mathematicsl model for the wafer shape[J].International Journal of Machine Tools and Manufacture,2004,44(07):707-716. |
| [26] | Sun W P;Pei Z J;Fisher G R .Fine grinding of silicon wafers:effects of chunk shape on grinding marks[J].International Journal of Machine Tools and Manufacture,2005,45(06):673-686. |
| [27] | Pei-Lum Tso;Chieng-Chung Teng .A study of the total thickness variation in the grinding of ultra-precision substrates[J].Journal of Materials Processing Technology,2001(2/3):182-188. |
| [28] | W.J. Liu;Z.J. Pei;X.J. Xin .Finite element analysis for grinding and lapping of wire-sawn silicon wafers[J].Journal of Materials Processing Technology,2002(1/3):2-9. |
| [29] | Z. J. Pei;X. J. Xin;W. Liu .Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment[J].International Journal of Machine Tools & Manufacture: Design, research and application,2003(1):7-16. |
| [30] | Xuekun Sun;Z. J. Pel;X. J. Xin;Mandy Fouts .Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments[J].International Journal of Machine Tools & Manufacture: Design, research and application,2004(1):11-19. |
| [31] | Pei Z J;Kassir S;Milind Bhagavat et al.An experimental investigation into soft-grinding of wire-sawn silicon wafers[J].International Journal of Machine Tools and Manufacture,2004,44(02):299-306. |
| [32] | Sun W P;Pei Z J;Fisher G R .Fine grinding of silioon wafers:machine configuration for spindle angle adjustments[J].International Journal of Machine Tools and Manufacture,2005,45(01):51-61. |
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