利用Cu、Ti、B三种粉末,反应热压制备了原位TiB2p/Cu复合材料,采用XRD、扫描电镜和透射电镜分析了原位复合材料的显微组织.热压状态下,XRD分析表明材料体系在一定的工艺条件下能够完全生成TiB2p;SEM分析表明,TiB2颗粒在基体Cu中弥散、均匀分布;TEM分析发现TiB2颗粒呈六边形,尺寸约为几十微米.TiB2颗粒与基体结合良好,界面清洁,无污染.TiB2p/Cu复合材料的显微硬度及拉伸性能较基体Cu都有所提高.
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