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综述了导热脂、导热胶黏剂、导热橡胶、导热胶带及相变材料等几类界面导热材料(TIMs)的组成成分、制备方法、主要性能、应用领域及其优化设计方法,并对国内外界面导热材料的发展进行了展望.

参考文献

[1] 孙春雷.有源液晶显示器加固技术探讨[J].长沙理工大学学报(自然科学版),2002(04):20-24.
[2] 赵兰萍,徐烈,李兆慈.固体界面间接触导热的机理和应用研究[J].低温工程,2000(04):29.
[3] Luke Maguire;Masud Behnia;Graham Morrison.A systematic evaluation of thermal performance of interface materials in high power amplifiers[A].IEEE,2003:355.
[4] Chiu Chiapin;Solbrekken G L;Young T M.Thermal modeling and experimental validation of thermal interface performance between non-flat surface[A].IEEE,2000:55-62.
[5] 湛利华,李晓谦,胡仕成.界面接触热阻影响因素的实验研究[J].轻合金加工技术,2002(09):40-43.
[6] Mok L S.Thermal management of silicon-based multichip modules[A].IEEE,1994:59-63.
[7] Arun Gowda;David Esler;Sara N.Paisner.Reliability Testing of Silicone-based Thermal Greases[A].,2005
[8] Sheila Liza B.Dal.Degradation mechanisms of siloxanebased thermal interface materials under reliability stress conditions[A].Phoenix,2004:537-541.
[9] 任红艳;胡金刚 .接触热阻和接触导热材料[J].宇航材料工艺,1999,29(06):13.
[10] 王政.用于集成电路封装的有机复合高导热灌封料[J].安徽化工,2001(01):41-44.
[11] Prabhakumar.Comparison of the adhesion strength of epoxy and silicone based thermal interface materials[A].IEEE,2003:1809-1814.
[12] 吴金林.低温导热绝缘胶黏剂研究[J].低温工程,1998(03):51-54.
[13] 陈江涛;赵云峰;吴金林.阻尼导热导电多功能胶黏剂研究[A].福建厦门,2001
[14] 陈江涛;赵云峰;吴金林.阻尼导热绝缘胶黏剂研究[A].山西太原,2001
[15] Scialdone J J;Clatterhuck C H;Wall J L.Thermal conductance of two interface materials and their applications in space systems[A].Washington:AIAA,1992:1-9.
[16] 赵云峰 .高性能粘弹性阻尼材料及其应用[J].宇航材料工艺,2009,39(05):l-6.
[17] Bob Rauch.Understanding the performance characteristics of phase-change thermal interface materials[A].IEEE,2000:42.
[18] 张丽芝;张庆 .相变贮热材料[J].化工新型材料,1999,27(02):20.
[19] Konstantin Golemanov;Slavka Tcholakova;Nikolai D.Denkov;Theodor Gurkov .Selection of Surfactants for Stable Paraffin-in-Water Dispersions,undergoing Solid-Liquid Transition of the Dispersed Particles[J].Langmuir: The ACS Journal of Surfaces and Colloids,2006(8):3560-3569.
[20] Zhang S Mark;Diane Swarthout;Feng Q Jane.Alkyl methyl silicone phase change materials for thermal interface applications[A].IEEE,2002:485-487.
[21] 康学勤,孙智.陶瓷纤维填充聚烯烃复合材料的导热性能研究[J].塑料工业,2004(03):52-53.
[22] Luiz Meyey;Shesha Jayaram;Cherney E.Thermal characteristics of filled silicone rubber under laster heating[A].IEEE,2003:383-386.
[23] Luiz Meyey;Shesha Jyaram;Edward Cherney.Thermal conductivity of filled silicone rubber and its relationship to erosion resistance in the inclined plane test[A].,2004:620-629.
[24] Toshio Miyahara;Kouichi Tanabe;Mitsuo Shimazaki.New products developed using environment-friendly elastomer rubber[J].Furukawa Review,2002(22):4.
[25] 北京粘接学会.胶粘技术与应用手册[M].北京:宇航出版社,1991:710.
[26] 李侃社,王琪.导热高分子材料研究进展[J].功能材料,2002(02):136-141,144.
[27] 李淘,沈强,王传彬,张联盟,余明清.AIN陶瓷的烧结致密化与导热性能[J].中国陶瓷,2005(01):39-42,34.
[28] 汪倩,高伟,谢择民.高导热室温硫化硅橡胶和硅脂[J].有机硅材料,2000(01):5-7.
[29] 马传国,容敏智,章明秋.导热高分子复合材料的研究与应用[J].材料工程,2002(07):40-45.
[30] 潘大海,刘梅,孟岩,齐士成.导热绝缘室温硫化硅橡胶的研制[J].橡胶工业,2004(09):534-536.
[31] 汪雨荻,周和平,乔梁,陈虎,金海波.AlN/聚乙烯复合基板的导热性能[J].无机材料学报,2000(06):1030-1036.
[32] Xu Yunsheng.Composite materials through interface,paste,shape and perform engineering[M].State University of New York,2002:180.
[33] Ervin Vincet J;Klett James W;Mundt Chad M .Estimation of the thermal conductivity of composites[J].Journal of Materials Science,1999,34:3545.
[34] Lewis T;Nielsen L .Dynamic mechanic properties of particulate-filled composites[J].Journal of Applied Polymer Science,1970,14(01):449.
[35] Agari Y;Uno T .Estimation on thermal conductivities of pilled polymer[J].Journal of Applied Polymer Science,1986,32(05):705-708.
[36] Agari Y;Tanaka M;nagai S;Uno T .Thermal conductivity of a polymer composite filled with mixtures of particles[J].Journal of Applied Polymer Science,1987,34:1429.
[37] Ravi,S.Prasher.Thermal contact resistance of cured gel polymeric thermal interface material[A].,2004:702-708.
[38] Ravi,S.Prasher.Rheology base modeling and design of particle laden polymeric thermal interface materials[A].,2005:230-236.
[39] Vishal singhal;Tomas siegmund;Suresh V.Garimella.Optimization of thermal interface materials for electronics cooling applications[A].,2004:244-251.
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