通过对不同的z-pin角度、面板厚度、去除泡沫处理的X-Cor夹层结构试样进行平压性能试验和分析比较,得到其破坏模式及不同设计参数对性能的影响.试验结果表明:X-Cor夹层结构中z-pin和泡沫存在协同增强效应;增大z-pin端部约束和减少z-pin的植入角度能提高平压性能;但z-pin角度为0°的夹层结构平压性能对植入角的角偏差缺陷更敏感,缺陷的存在影响承力性能.
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