在PECVD法制备a-Si∶H薄膜材料基础上, 以XeCl准分子激光烧结为手段, 对在玻璃衬底上制备多晶硅薄膜材料的工艺条件进行了探索, 利用XRD、 SEM、 Raman光谱等分析测试手段对所制备材料的结构特征进行了表征. 较高的衬底温度、合适的激光能量密度和脉冲频率, 有利于获得高质量的多晶硅薄膜.
参考文献
[1] | 黄锡珉. TFT LCD技术的进步 [J]. 液晶与显示, 1999, 14(2):79-89. |
[2] | Lee S, Joo S. Low temperature poly-Si thin-film transistor fabrication by metal-induced lateral crystallization [J]. IEEE Electron Device Lett., 1996, 17(4):160-162. |
[3] | 刘传真, 杨柏梁, 李牧菊, 等. 激光退火法低温制备多晶硅薄膜的研究 [J]. 液晶与显示, 2000, 15(1):46-52. |
[4] | 刘传真, 杨柏梁, 张玉, 等. 金属诱导法低温多晶硅薄膜的制备与研究 [J]. 液晶与显示, 2000, 15(4):250-254. |
[5] | Nakahata K, Miida A, Kamiya T, et al. Control of orientation for polycrystalline silicon thin films fabricated from fluorinated source gas by microwave plasma enhanced chemical vapor deposition [J]. Jpn. J. Appl. Phys., 1998, 37:L1026-L1029. |
[6] | Soo Y Y, Ki H K, Chae O K. Low temperature metal crystallization of amorphous silicon using a Ni solution [J]. J. Appl. Phys., 1997, 82 (11):5865-5867 |
[7] | Masaki Y, Suzuki M, Kitagawa A. Transient phases of a-Si by rapid heating [J]. J. Appl. Phys., 1995, 77(4):1766-1770. |
[8] | Ozawa M, OH C H, Matsumra M. Two dimensionally position-controlled excimer-laser-crystallization of silicon thin films on glassy substrate [J]. Jpn. J. Appl. Phys., 1999, 38:5700-5705. |
[9] | Kuriyama H, Kiyama S, Noguchi S, et al. Enlargement of p-Si film grain size by excimer laser annealing and its application to high-performance p-Si thin film transistor [J]. Jpn. J. Appl. Phys., 1991, 30(12B):3700-3703. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%