采用VHF-PECVD技术在多功能系统(cluster tool)中制备了系列硅薄膜,研究薄膜的均匀性及电学特性和结构特性.结果表明:气压和功率的合理匹配对薄膜的均匀性有很大的影响;材料的喇曼测试和电学测试结果表明微晶硅薄膜存在着纵向的结构不均匀,在将材料应用于器件上时,必须要考虑优化合适的工艺条件;硅烷浓度大,相应制备薄膜的晶化程度减弱,即薄膜中非晶成分增多.
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