讨论了在检测半导体器件和集成电路芯片时,不同研磨倾斜角度对扩展电阻量值的影响。
The effects of choosing lapping bevel angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
参考文献
| [1] | 陆逢涛.扩展电阻技术[J].半导体技术,1987(05):47-53. |
| [2] | 金德宣;李宏扬.VLSI工艺技术[M].上海:半导体技术编辑部,1985:70-72. |
| [3] | 张敬海.硅材料质量和硅器件工艺[M].上海:上海科学技术文献出版社,1979:111. |
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