研究了 Ni－ Cu－ P化学镀液主要成分、 pH值及时间等工艺参数对化学沉积 Ni－ Cu－ P合金 镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数，得到了 Cu含量从 0到 56.18wt％ 的 Ni－ Cu－ P合金镀层。利用 X射线能谱术 (EDS) 和 X射线衍射术 (XRD)研究了镀液中硫酸铜 浓度对 Ni－ Cu－ P合金镀层成分及组织结构的影响。在硫酸铜浓度低于 3g/l时， Ni－ Cu－ P合金 镀层中 P含量高于 7.05wt％，合金镀层是非晶态结构。
Effects of the deposition parameters such as bath composition, pH and time on the element contents and deposition rate of the electroless Ni－ Cu－ P deposits were studied. The electroless Ni－ Cu－ P deposits with various copper contents from 0 to 56.18 wt％ were prepared by choosing the proper deposition parameters. The effect of copper sulfate concentration in the bath on the composition and microstructure of the electroless Ni－ Cu－ P deposits was studied by X－ ray energy dispersive spec－ troscopy (EDS) and X－ ray diffraction(XRD). Ni－ Cu－ P deposits with phosphorus content more than 7.05wt％ are amorphous, in the situation that the copper sulfate concentration in the bath is lower than 3g/l.
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