用 CMOS工艺实现了非接触式 IC卡天线的集成化所需要考虑的多个方面,建立了集成天 线的模型,导出了合理的设计方案,并通过实验验证了模型和设计方案.实验结果表明,采用片 上天线完全可以提供非接触式 IC卡工作所需要的能量.在频率为 22.5MHz、感应强度为 6Gs的 磁场中,面积为 2mm× 2mm的集成天线可以为 10kΩ的负载提供 1.225mW的能量.
参考文献
[1] | Daniel J Sadler;Wenjin Zhang;Chong H Ahn .Micro-Machined Semi-ncapsulated Spiral Inductors for Electro-Mechanical Systems Applications[J].IEEE Transactions on Magnetics,1997,33(05):3319-3321. |
[2] | Dirk Dudenbostel;Karl-udwig Krieger;Claudia Candler.A New Passive CMOS Telemetry Chip to ReceivePower and Transmit Data for a Wide Range of Sensor Applications[A].,1997:995-997. |
[3] | Jeffrey A Von Arx;Khalil Najafi.On-hip Coils withIntegrated Cores for Remote Inductive Powering of IntegratedMicrosystems[A].,1997:999-1002. |
[4] | Soohoo R F .Magnetic Thin Film Inductors for IntegratedCircuit Application[J].IEEE Transactions on Magnetics,1979,15(06):1803-1805. |
[5] | Chong H. Ahn;Allen M.G. .A fully integrated surface micromachined magnetic microactuator with a multilevel meander magnetic core[J].Journal of Microelectromechanical Systems: A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems,1993(1):15-22. |
[6] | Chang J Y C;Abidi A Asad;Gaitan Michal.Large Sus-pended Inductors on Silicon and Their Use in a 2-μ mCMOS RF Amplifier[J].IEEE Transactions on Electron Devices,1993:246-248. |
[7] | Malamy C Adam;Glasser A Lance;Selvidge W Charles .AMagnetic Power and Communication Interface for a CMOSDie[R].ISSCC Digest of Technical Papers,1988. |
[8] | Bouvier J;Thorigne Y;Abou Hassan S et al.A SmartCard CMOS Circuit with Magnetic Power and Communica-2期倪昊等 :非接触式 IC卡天线的 CMOS集成化设计 199tions Interface[R].ISSCC Digest of Technical Papers,1997. |
[9] | Andre Abrial;Jacky Bouvier;Marc Renaudin;Patrice Senn;Pascal Vivet .A new contactless smart card IC using an on-chip antenna and an asynchronous microcontroller[J].IEEE Journal of Solid-State Circuits,2001(7):1101-1107. |
[10] | Greenhouse H M.Design of Planar Rectangular Microelectronic Inductors[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1974:101-109. |
[11] | Patrick Yue C;Simon Wong S.Physical Modeling of SpiralInductors on Silicon[J].IEEE Transactions on Electron Devices,2000:560-567. |
[12] | Pun A.L.L.;Yeung T.;Lau J.;Clement J.R.;Su D.K. .Substrate noise coupling through planar spiral inductor[J].IEEE Journal of Solid-State Circuits,1998(6):877-884. |
[13] | Patrick Yue C;Simon Wong S.On-hip Spiral Inductorswith Patterned Ground Shields for Si-ased RF IC's[J].IEEE Journal of Solid-State Circuits,1998:743-751. |
[14] | 刘畅,陈学良,严金龙.新颖的衬底pn结隔离型硅射频集成电感[J].半导体学报,2001(12):1486-1489. |
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