结合中等剂量的氢离子注入和阳极键合( Anodic bonding),利用智能剥离技术( Smart-ut) 成功转移了一层单晶硅到玻璃衬底上.采用剖面透射电镜、高分辨透射电镜、扫描电镜和拉曼光 谱等对 SOG材料进行了研究,结果表明此技术制备的 SOG材料具有界面陡峭、平整,顶层硅单晶 质量完好等优点.
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