异质外延法是目前制备新型 SOI材料的技术途径之一.采用低压化学气相沉积技术(LPCVD)在硅衬底上先外延γ-Al2O3绝缘单晶薄膜,制备出硅衬底上外延氧化物外延结构γ-Al2O3/Si(EOS),然后采用类似 SOS薄膜生长的常压 CVD(APCVD)方法在 EOS上外延硅单晶薄膜,形成新型硅基双异质 SOI材料 Si/γ-Al2O3/Si.利用反射高能电子衍射(RHEED)、X射线衍射(XRD)、俄歇电子能谱(AES)及 MOS电学测量等技术表征分析了 Si(100)/γ-Al2O3(100)/Si(100)SOI异质结构的晶体结构、组分和电学性能.测试结果表明,已成功实现了高质量的新型双异质外延 SOI结构材料Si(100)/γ-Al2O3(100)/Si(100),γ-Al2O3与 Si外延薄膜均为单晶,γ-Al2O3薄膜具有良好绝缘性能,SOI结构界面清晰陡峭,该 SOI材料可应用于 CMOS电路的研制.
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