PMMA微流控基片在热压成形结束后由于模具和聚合物的热膨胀系数不同--热不匹配会产生残余应力,从而造成基片翘曲变形.本文采用基片曲率法来研究热压过程中基片中的残余应力,分析热压过程参数:温度、时间、压力对残余应力的影响,并确定使残余应力达到最小时的热压参数,当脱模温差在10%左右时,热压成型后的变形较小.最后通过有限元仿真来考察热压过程中的应力变化.
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