分别研究了0.18μm NMOSFETS的传统漏雪崩热载流子(DAHC)和衬底偏压增强电子注入(SEEI)的退化机制.结果表明,在这两个偏置条件下,界面缺陷的产生均是导致热载流子诱导器件性能退化的主导因素.界面缺陷诱导的反型层电子迁移率下降是导致先进深亚微米NMOSFETS电学特性退化的根本原因.
Hot carrier degradation under conventional maximum substrate current Ib, max and substrate enhanced electron injection (SEEI) in 0. 18μm channel length NMOSFETS is studied. It is found that the interface trap generation is the dominant mechanism for hot cartier degradation under these two stress conditions. As a result, the interface traps induced the inversion layer mobility reduction is responsible for the electrical parameter degradation in deep sub - micron NMOSFETS during SEEI stress.
参考文献
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