采用匀胶旋涂技术将WO3溶胶沉积在硅纳米孔柱阵列(si-NPA)衬底上,经500℃退火制得WO3/Si-NPA复合薄膜.场发射扫描电镜和x射线衍射的表面形貌和结构分析表明,WO3在Si-NPA表面形成连续薄膜,且复合薄膜保持了Si-NPA规则阵列结构的特点.湿敏测试结果显示:在11%到95%的相对湿度范围内,WO3/Si-NPA湿敏元件输出电容强,且随测试频率的增加而单调降低;随着WO3薄膜厚度的增加,湿敏元件灵敏度明显增大,但元件相应的响应/恢复时间却延长.
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