研究Si/Si键合的电学性质对于界面研究和微电子器件的制备有着重要意义.分析了亲水处理方法键合的不同Si/Si键合结构的I-V特性,然后用SOS模型对n-Si/n-Si的C-V特性做了计算机辅助模拟,并和实际C-V曲线比较得出了平带电压VFB和界面态密度Din,这些结果对于键合的界面性质的了解和研究都是有意义的.
参考文献
[1] | Reznicek A,Senz S,Breitenstein O.Electrical characterization of UHV-bonded silicon interfaces [OL].Proceedings of MRS Online Pablications(www.mrs.org),681E:I44. |
[2] | Fedotov A,Saad A M H,Enisherlova K,et al.Electrical properties of Si/SiO2/Si structures produced by direct bonding of pre-oxidized silicon wafers [J].Microelectronic Engineering,2003,66:522-529. |
[3] | Han Weihua.The Reseaches of Theory and Thechnology for Silicon Wafer Bonding(硅片键合理论与技术研究)[D].Doctoral Dissertation of Institute of Semiconductors,Chinese Academy of Sciences.9880136.04(in Chinese). |
[4] | Depas M,Vermeire B,et al.Determination of tunnelling parameters in ultra-thin oxide layer poly-Si/SiO2/Sistructures [J].Solid-state Electronics,1995,38(8):1465-1471. |
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