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研究了形变Cu-20vol%Fe原位复合材料的组织结构,结果发现,合金经室温变形后,Fe相由铸造态的树枝状变成纤维状组织,在纵截面上呈现片状,其厚度随变形量增加而减小,在横断面上呈弯曲的薄片状.随变形量增加,Cu-20vol%Fe合金的强度提高.适当的中间热处理可以大大降低其电阻率,经过室温形变和中间热处理的合理配合,可获得良好强度和电导率的结合.

参考文献

[1] Snoeck E;Lecouturier F;Thilly L et al.Microstmctural studies of in situ produced filamentary Cu/Nb wires[J].Scripta Materialia,1998,38(11):1643-1648.
[2] Sakai Y;Inoue K;Asano T et al.Development of high-strength,high-conductivity Cu-Ag alloys for high-field pulsed magnet use[J].Applied Physics Letters,1991,59:2965-2967.
[3] Bevk J;Harbison J P;Bell J L .Anomalous increase in strength of in situ formed Cu-Nb multifilamentarycomposites[J].Journal of Applied Physics,1978,49:6031-6038.
[4] C. BISELLI;D. G. MORRIS .MICROSTRUCTURE AND STRENGTH OF Cu-Fe IN SITU COMPOSITES AFTER VERY HIGH DRAWING STRAINS[J].Acta materialia,1996(2):493-504.
[5] Jerman G A;AndersonI E;Verhoeven J D .Strength and electrical conductivity of deformation-processed Cu-15 vol pct Fe alloys produced by powder metallurgy techniques[J].Metallurgical and Materials Transactions,1993,24:35-42.
[6] HongSI;Song J S;Kim H S .Thermo-mechanical procesing and properties of Cu-9Fe-1 .2Co microcomposite wires[J].Scripta Materialia,2001,45(11):1295-1300.
[7] S.I.HONG;J.S.SONG .Strength and Conductivity of Cu-9Fe-1.2X (X = Ag or Cr) Filamentary Microcomposite Wires[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2001(4):985-991.
[8] BOLTAX A .Precipitation processes in copper-rich copper-alloys[J].Transactions of the Metallurgical Society of AIME,1960,218:812-821.
[9] Spitzig W A;Chumbley L S;Verhoeven J D et al.Effect of temperature on the strength and conductivity of a deformation processed Cu-20% Fe composite[J].Journal of Materials Science,1992,27:2005-2011.
[10] GO Y S;Spitzig W A .Strengthening in deformation-processed Cu-20%Fe composites[J].Journal of Materials Science,1991,26:163-171.
[11] Biselli C;Morris D G .Microstructure and strength of Cu-Fe in situ composites obtained from prealloyed Cu-Fe powders[J].Acta Materialia,1994,42:163-176.
[12] Hosford William F.The mechanics of crystals and textured polycrystals[M].Now york,1993:115-118.
[13] Verhoeven J D;Downing H I;Chumbley L S et al.The resistivity and microstructure of heavily drawn Cu-Nb alloys[J].Journal of Applied Physics,1989,65:1293-1301.
[14] S.I. Hong;M.A. Hill .MICROSTRUCTURE AND CONDUCTIVITY OF Cu-Nb MICROCOMPOSITES FABRICATED BY THE BUNDLING AND DRAWING PROCESS[J].Scripta materialia,2001(10):2509-2515.
[15] Frank Heringhaus;Hans-Jorg Schneider-Muntau;Gunter Gottstein .Analytical modeling of the electrical conductivity of metal matrix composites: application to Ag-Cu and Cu-Nb[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):9-20.
[16] PELTON A R;Laabs F C;Spitzig W A et al.Microstructural analysis of in-situ Cu-Nb composite wires[J].ULTRAMICROSCOPY,1987,22:251-265.
[17] HongSIHillMA .Microstructural stability and mechanical response of Cu-Ag microcompesite wires[J].冶金材料学报,1998,46:4111-4122.
[18] Sun Ig Hong;Mary Ann Hill .Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(1/2):189-197.
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