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采用机械合金化方法制备Cu-4wt%C过饱和固溶体,通过SEM和XRD分析研究了机械合金化中Cu-C复合粉末的形貌变化及碳在铜中的固溶度扩展问题.结果表明,机械合金化过程中Cu粉和C粉形成了层状复合粉末;随着球磨时间的增加,C的衍射峰逐渐消失,Cu的衍射峰逐渐宽化,并且位置发生偏移;球磨24h后,C原子固溶到Cu中,Cu的点阵常数达到0.3620nm,晶格膨胀了0.15%.

参考文献

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